With the iPhone maker’s long-awaited media event only days away, the flood of leaks still continues to pour out of Apple’s (NASDAQ:AAPL) China-based supply chain. The latest leaked images purport to show the logic board, or motherboard, for the upcoming iPhone 5C.
The images have reportedly been posted on many different Chinese tech websites over the weekend. However, these particular images were found on the Chinese microblogging site Weibo, via the French website Nowhereelse.fr.
Unfortunately, Apple fans hoping to catch an early glimpse of the iPhone 5C processor and other internal components may be disappointed by these images. All of the logic boards pictured already have protective shielding over the internal circuitry.
Although the authenticity of this latest leak cannot be confirmed, Steve Hemmerstoffer at Nowhereelse.fr notes that some the attachment points on these logic boards appear to match previously leaked images of unshielded logic boards. Based on this congruency, he believes that these are genuine iPhone 5C logic boards.
Apple’s iPhone 5C is rumored to use the same A6 processor that is found in Apple’s iPhone 5, while the iPhone 5S is rumored to come equipped with an A7 chip that is 31 percent faster. Apple has already sent out invitations for a September 10 media event where it is expected to unveil both new iPhone models.
This will be the first time that Apple will release two different iPhone models at the same time. The lower-cost plastic iPhone 5C is believed to be geared towards China and other emerging markets. As reported by Barron’s, Morgan Stanley analyst Katy Huberty believes that the iPhone 5C will put Apple “on the path to smartphone market share leadership” in the world’s largest country.
Here’s how Apple closed out the trading week.
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